Backgrinding
As part of the value-added service, Hua Hong NEC provides 8-inch wafer backgrinding service. Equipped with the advanced high precision wafer backgrinding tools, HHNEC has demonstrated high quality performance on more than two million wafers, including well-polished surface, excellent flatness, and stable volume production. HHNEC's high quality performance plus competitive price significantly improve the product "time-to-market" and competitiveness. Up to today, HHNEC can manufacture 7 mils backgrinding with volume mass production, and is developing as thin as 6 mils backgrinding. HHNEC will offer less than 4 mils backgrinding service very soon.

Wafer Backgrinding Flow Chart

Wafer Sawing
As part of the value-added service, Hua Hong NEC provides the wafer sawing service with high quality performance and competitive price through the collaboration with world leading supplier. HHNEC offers the different width of scribe line service that can benefit customer backend process, simplify its supply chain management step.