| Jan.2010 |
Hua Hong NEC successfully launches the solution of advanced 0.13um Embedded EEPROM |
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| Dec.2009 |
Hua Hong NEC launches efficient nvSOC Prototype Platform |
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| Oct.2009 |
Hua Hong NEC launches 400V HV MOSFET Process |
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| Sep.2009 |
Hua Hong NEC announces mass production on 0.162um CIS Process |
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| Sep.2009 |
Hua Hong NEC successfully developed POC solution with high ESD Performance based on 0.13um NVM Platform |
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| Aug.2009 |
Hua Hong NEC announces mass production on 0.35um Non-epi BCD Process |
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| May.2009 |
Hua Hong NEC wins the honor of “National Labour Award” |
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| Sep.2008 |
Hua Hong NEC Launches 0.5um CA500C Analog Process Platform |
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| Aug.2008 |
Hua Hong NEC and Shanghai Huahong Integrated Circuit Co.,Ltd successfully co-developed the products based on 0.13um Embedded Flash Process.
Jul.2008 Hua Hong NEC successfully accomplish the development of 0.13um Embedded Flash Process
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| Jul.2008 |
Hua Hong NEC successfully accomplish the development of 0.13um Embedded Flash Process |
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| Apr.2008 |
Hua Hong NEC wins the honor of 2008 Shanghai Labour Award |
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| Feb.2008 |
The production of Hua Hong NEC ON08 Analog Circuit has made a breakthrough of 10,000. |
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| Nov.2007 |
Hua Hong NEC Fab1 successfully passed the compliance audit for TS16949 Quality Management System, and Fab2 Successfully Passed Audit for ISO9001/ISO27001 Extension Certification. |
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| Oct.2007 |
Hua Hong NEC received the Validated End-User ("VEU") authorization from U.S. Commerce Department's Bureau of Industry and Security. Hua Hong NEC is one of five famous companies as the first group approved for the VEU program in China. |
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| Sep.2007 |
Fab II of Hua Hong NEC received certification of reliability test from the end-users, and commenced mass production. |
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| Aug.2007 |
Construction of Hua Hong NEC's Fab 1C completed |
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| Aug.2007 |
Hua Hong NEC's 0.16um CMOS process technology entered into production |
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| Jun.2007 |
0.18um RFCMOS process released to production |
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| May.2007 |
0.5um HV 40V LCD driver parts process released to production |
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| Mar.2007 |
Equipment of Fab 2 moved in |
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| Mar.2007 |
0.35um downsizing HV 14V CMOS process released to production |
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| Aug.2006 |
Construction project of Fab1C production line started |
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| Aug.2006 |
0.25um HV 18V CMOS process released to production |
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| Apr.2006 |
Hua Hong NEC successfully achieved monthly capacity of 53K 8" wafers |
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| Nov.2005 |
Hua Hong NEC successfully achieved monthly capacity of 50K 8" wafers |
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| Oct.2005 |
Hua Hong NEC developed 0.25um Embedded eFlash Memory |
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| Aug.2005 |
Hua Hong NEC's 0.18um process technology entered into mass production |
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| Aug.2005 |
0.35um HV 14V CMOS process released to production |
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| Jul.2005 |
0.18um mixed signal process released to production |
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| Jun.2005 |
0.25um eFlash, 0.18um Logic & HV processes ready for mass production |
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| Mar.2005 |
0.35um OTP process released for mass production |
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| Nov.2004 |
Fab 2 clean room and facilities ready |
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| Oct.2004 |
0.25um RFCMOS process went into production |
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| Jun.2004 |
Shanghai Belling and Shanghai Zhangjiang Group became shareholders of Hua Hong NEC by yielding Beiling-Zhangjiang 2nd factory building & its premises
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| Oct.2003 |
New strategic partnership was established between JAZZ of USA and Huahong International |
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| Jun.2003 |
0.33um eFlash process went into production |
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| Oct.2002 |
The Power MOS process went into production |
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